Product Introduction: The machine can unstacking the LD bar after coating and transfer to Gel-pak tray or tape. More over it can recognize the Chip ID.

Bar and Spacer Materials: Si, GaAs, InP, and other semiconductor materials.

• High Speed and Precision: Equipped with linear motors, achieving a production efficiency of 10 seconds per group(including 1pcs bar and 1pcs spacer)
  

• Visual Positioning: Full-vision alignment system accurately identifies the position of each product, can recognize the Chip ID
  

• Real-Time Demonstration: Vision system supports real-time mode switching, enabling visible and controllable adjustments for debugging and fine-tuning
  

• Class 100 Dustproof Environment: Constructed with a mirror-finished stainless steel frame and high-efficiency air filtration units to maintain a clean workspace
  

• Precision unloading Place location: The Location table reply the higher accuracy of ± 1um
  

• Efficient Output: Dual workstations and dual suction nozzles for pick-and-place operations, combined with alternating dual coating jig workflows for uninterrupted production, meeting high-volume application demands
  

Product Inquiry Hotline：：：+86-138-1192-8592（Mr. Mao）
Product Inquiry Email：：： jian.mao@incubecn.com

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